View TSOP5700_441391.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

VISHAY
TSOP5700
Vishay Semiconductors
IR Receiver for High Data Rate PCM at 455 kHz
Description
The TSOP5700 is a miniaturized SMD IR receiver for infrared remote control and IR data transmission. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter. The demodulated output signal can directly be decoded by a microprocessor. The main benefit is the operation with high data rates and long distances.
1
2
3
4
16797
Features
* Photo detector and preamplifier in one package * Internal Bandfilter for PCM frequency * Internal shielding against electrical field disturbance * TTL and CMOS compatibility * Output active low * Small size package * Short settling time after power on * High envelope duty cycle can be received * Enhanced immunity against disturbance from energy saving lamps * Taping available for topview and sideview assembly
Special Features
* Data rate 20 kbit/s * Supply voltage 2.7 - 5.5 V
Mechanical Data
Pinning: 1 = GND, 2 = NC, 3 = OUT, 4 = VS
Block Diagram Application Circuit
16840
4 10 k Input PIN AGC Band Pass Demodulator
VS
16843
3
OUT
Circuit
Transmitter TSOPxxxx with TSHFxxxx
R1 = 47 VS C1 = 4.7 F R2 >= 1 k +VS
OUT GND
C
VO GND
1 Control Circuit
GND
R1 + C1 recommended to suppress power supply disturbances. R2 optional for improved pulse forming.
Document Number 82166 Rev. 5, 14-Aug-03
www.vishay.com 1
TSOP5700
Vishay Semiconductors Absolute Maximum Ratings
Tamb = 25 C, unless otherwise specified Parameter Supply Voltage Voltage at output to supply Supply Current Output Voltage Output Current Junction Temperature Storage Temperature Range Operating Temperature Range Power Consumption Tamb 85 C Pin 4 Pin 3 Pin 4 Pin 3 Pin 3 Test condition Symbol VS VS - VO IS VO IO Tj Tstg Tamb Ptot Value - 0.3 to + 6.0 - 0.3 to (VS + 0.3) 5 - 0.3 to + 6.0 15 100 - 40 to + 85 - 25 to + 85 50
VISHAY
Unit V V mA V mA C C C mW
Electrical and Optical Characteristics
Tamb = 25 C, unless otherwise specified Parameter Supply Current (Pin 4) Supply Voltage (Pin 4) Transmission Distance p = 870 nm, IR Diode TSHF5400, IF = 300 mA p = 950 nm, IR Diode TSAL6400, IF = 300 mA Threshold Irradiance Maximum Irradiance Output Voltage Low (Pin 3) Output Voltage High (Pin 3) Bandpass filter quality Out-Pulse width tolerance Delay time of output pulse Receiver start up time Falling time Rise time Directivity Optical test signal of Fig.1, 2.5 mW/m2 Ee 30 W/m2 Optical test signal of Fig.1, Ee > 2.5 mW/m2 Valid data after power on Leading edge of output pulse No external pull up resistor 1 k external pull up resistor Angle of half transmission distance tV tf tr tr 1/2 50 0.4 12 1.2 50 s s s s deg tdon 15 36 s p = 870 nm, optical test signal of Fig.1 Optical test signal of Fig.1 1 k external pull up resistor No external pull-up resistor, test signal see fig. 1 Test condition Dark ambient Ev = 40 klx, sunlight Symbol ISD ISH VS dmax 2.7 Min Typ. 2.0 2.3 5 15 5.5 Max 2.7 Unit mA mA V m
dmax
9
m
Ee min Ee max VQL VQH Q tpo - 15 VS - 0.25 30
1.5
2.5
mW/m2 W/m2
100
mV V
10 +5 + 15 s
www.vishay.com 2
Document Number 82166 Rev. 5, 14-Aug-03
VISHAY
Typical Characteristics (Tamb = 25 C unless otherwise specified)
Jitter of Output Pulse ( s )
TSOP5700
Vishay Semiconductors
30 N=10 cycles/burst 25 20 Jitter - tpo 15 10 5 0 0.1 Jitter - tdon 1 1.0 10 100 1000 10000.0 10.0 100.0 1000.0 10000 100000 100000.0 Ee - Irradiance (mW/m2)
Optical Test Signal (f=455kHz, 10 cycles/burst) Ee
tpi = 22 s 2.2 s
> 48.6 s (min. duty cycle)
tdon
t
16563
VQ VQH 50% VQL
tpo = tpi i 15 s
tpo
90% 10%
tf tr
t
16791
Figure 1. Output Function
j tdon, j
tpo -
Output Signal of TSOP5700
Figure 4. Jitter of Output Pulse
1.0
Optical Test Signal
Ee min / Ee rel - Responsitivity
(IR diode TSHF5400, p 870 nm, IF = 300 mA, f = 455 kHz, 10 cycles/burst)
0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 300 350 400 450 500 550 600
Ee
tpi = 22 s
t
Output Signal of TSOP5700 VO VOH VOL
jtdon
jitter of leading edge jtpo jitter of output pulse width
tdon tpo
16565
t
16751
f - Frequency ( kHz )
Figure 2. Output Fucntion (mit Jitter)
Figure 5. Frequency Dependence of Responsivity
Ee min - Threshold Irradiance ( mW/m 2 )
35
Output Pulse Length ( s )
14 12 10W/m 2 1.4klx (Std.illum.A,T= 2855 K) 10W/m 2 8.2klx (Daylight,T = 5900 K) i 10 8 6 Ambient, = 950 nm 4 2 0 0.1
i
i
Output pulse width - tpo
Correlation with ambient light sources:
30 25 20 15 10 5 0 0.1 N = 10 cycles/burst Delay time - tdon
t
don,
t
po
1 1.0
16790
10 100 1000 10000.0 10.0 100.0 1000.0 10000 100000 100000.0 Ee - Irradiance (mW/m2)
1.0
10
100
16558
E - DC Irradiance (W/m 2 )
Figure 3. Output Pulse Diagram (tdon, tpo)
Figure 6. Sensitivity in Bright Ambient
Document Number 82166 Rev. 5, 14-Aug-03
www.vishay.com 3
TSOP5700
Vishay Semiconductors
VISHAY
Threshold Irradiance ( mW/m 2 )
2.8 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 2 3 4 5 6 V S - Supply Voltage ( V ) Sensitivity in dark ambient
S ( ) rel - Relative Spectral Sensitivity
3.0
1.2 1.0 0.8 0.6 0.4 0.2 0.0 750 800 850 900 950 1000 1050 1100 1150 - Wavelength ( nm )
Ee min
16559
16789
Figure 7. Sensitivity vs. Supply Voltage
Figure 10. Relative Spectral Sensitivity vs. Wavelength
1.1
E e min - Relative Sensitivity
0
10
20
30
1.0 0.9 1.0 0.8 0.7 0.6 0.5 0.9 0.8 0.7 50 60 70 80 0.6 0.4 0.2 0 0.2 0.4 0.6 d rel - Relative Transmission Distance 40
8
10 12 14 16 18 20 22 24 26 28 N - Burstlength ( carriercycles/burst )
16801
16788
Figure 8. Rel. Sensitivity vs. Burstlength
Figure 11. Directivity
2.3 2.2
I s - Supply Current ( mA )
2.1 2.0 1.9 1.8 1.7 1.6 1.5 -25 -15 -5
VS = 5.5 V VS = 2.7 V
5 15 25 35 45 55 65 75 85
16754
Tamb - Ambient Temperature ( C )
Figure 9. Supply Current vs. Ambient Temperature
www.vishay.com 4
Document Number 82166 Rev. 5, 14-Aug-03
VISHAY
Recommendation for Suitable Data Formats
The circuit of the TSOP5700 is designed in that way that disturbance signals are identified and unwated output pulses due to noise or disturbances are avoided. A bandpass filter, an automatic gain control and an integrator stage is used to suppress such disturbances. The distinguishing marks between data signal and disturbance are carrier frequency, burst length and the envelope duty cycle. The data signal should fulfill the following conditions: * The carrier frequency should be close to 455 kHz. * The burstlength should be at least 22 s (10 cycles of the carrier signal) and shorter than 500 s. * The separation time between two consecutive bursts should be at least 26 s. * If the data bursts are longer than 500 s then the envelope duty cycle is limited to 25 % * The duty cycle of the carrier signal (455 kHz) may be between 50 % (1.1 s pulses) and 10 % (0.2 s pulses). The lower duty cycle may help to save battery power.
TSOP5700
Vishay Semiconductors
Document Number 82166 Rev. 5, 14-Aug-03
www.vishay.com 5
TSOP5700
Vishay Semiconductors Package Dimensions in mm
VISHAY
16776
www.vishay.com 6
Document Number 82166 Rev. 5, 14-Aug-03
VISHAY
Taping Version TSOP5700..TT
TSOP5700
Vishay Semiconductors
16584
Document Number 82166 Rev. 5, 14-Aug-03
www.vishay.com 7
TSOP5700
Vishay Semiconductors Taping Version TSOP5700..TR
VISHAY
16585
www.vishay.com 8
Document Number 82166 Rev. 5, 14-Aug-03
VISHAY
Reel Dimensions
TSOP5700
Vishay Semiconductors
16734
Document Number 82166 Rev. 5, 14-Aug-03
www.vishay.com 9
TSOP5700
Vishay Semiconductors Leader and Trailer
VISHAY
Trailer
no devices devices
Leader
no devices
End
min. 200 min. 400
Start
96 11818
Cover Tape Peel Strength
According to DIN EN 60286-3 0.1 to 1.3 N 300 10 mm/min 165 - 180 peel angle
Label
Standard bar code labels for finished goods The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data.
www.vishay.com 10
Document Number 82166 Rev. 5, 14-Aug-03
VISHAY
TSOP5700
Vishay Semiconductors
Vishay Semiconductor GmbH standard bar code product label (finished goods) Plain Writing Item-Description Item-Number Selection-Code LOT-/ Serial-Number Data-Code Plant-Code Quantity Accepted by: Packed by: Mixed Code Indicator Origin Long Bar Code Top Item-Number Plant-Code Sequence-Number Quantity Total Length Short Bar Code Bottom Selection-Code Data-Code Batch-Number Filter Total Length Abbreviation - INO SEL BATCH COD PTC QTY ACC PCK MIXED CODE xxxxxxx+ Type N N X N - Type X N X - - Length 18 8 3 10 3 (YWW) 2 8 - - - Company Logo Length 8 2 3 8 21 Length 3 3 10 1 17
16942
Dry Packing
The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage.
Aluminium bag
Final Packing
The sealed reel is packed into a cardboard box. A secondary cardboard box is used for shipping purposes.
Label
Reel
15973
Document Number 82166 Rev. 5, 14-Aug-03
www.vishay.com 11
TSOP5700
Vishay Semiconductors Recommended Method of Storage
Dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: * Storage temperature 10 C to 30 C * Storage humidity 60 % RH max. After more than 72 hours under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 hours at 40 C + 5 C/ -0 C and < 5 % RH (dry air/ nitrogen) or 96 hours at 60 C +5 C and < 5 % RH for all device containers or 24 hours at 125 C +5 C not suitable for reel or tubes. An EIA JEDEC Standard JESD22-A112 Level 4 label is included on all dry bags.
VISHAY
16962
Operating Instructions
Reflow Soldering * Reflow soldering must be done within 48 hours stored under max. 30 C, 80 % RH after opening envelop * Recommended soldering paste (composition: SN 63 %, Pb 37 %) Melting temperature 178 C to 192 C * Apply solder paste to the specified soldering pads, by using a dispenser or by screen printing. * Recommended thickness of metal mask is 0.2 mm for screen printing. * The recommended reflow furnace is a combinationtype with upper and lower heaters. * Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown below. Excercise extreme care to keep the maximum temperature below 230 C. The following temperature profile means the tempera ture at the device surface. Since temperature difference occurs between the work and the surface of the circuit board depending on the pes of circuit board or reflow furnace, the operating conditions should be verified prior to start of operation. * Handling after reflow should be done only after the work surface has been cooled off. Manual Soldering * Use the 6/4 solder or the solder containing silver. * Use a soldering iron of 25 W or smaller. Adjust the temperature of the soldering iron below 300 C. * Finish soldering within three seconds. * Handle products only after the temperature is cooled off. Cleaning * Perform cleaning after soldering strictly in conformance to the following conditions: Cleaning agent: 2-propanol (isopropyl alcohol). Commercially available grades (industrial use) should be used.
16943
Example of JESD22-A112 Level 4 label
ESD Precaution
Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the Antistatic Shielding Bag. Electro-Static Sensitive Devices warning labels are on the packaging.
Vishay Semiconductors Standard Bar-Code Labels
The Vishay Semiconductors standard bar-code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Semiconductors specific data.
www.vishay.com 12
Document Number 82166 Rev. 5, 14-Aug-03
VISHAY
Demineralized or distilled water having a resistivity of not less than 500 m corresponding to a conductivity of 2 mS/m. * Temperature and time: 30 seconds under the temperature below 50 C or 3 minutes below 30 C. * Ultrasonic cleaning: Below 20 W.
TSOP5700
Vishay Semiconductors
Manual Soldering * Use the 6/4 solder or the solder containing silver. * Use a soldering iron of 25 W or smaller. Adjust the temperature of the soldering iron below 300 C. * Finish soldering within three seconds. * Handle products only after the temperature is cooled off. Cleaning * Perform cleaning after soldering strictly in conformance to the following conditions: Cleaning agent: 2-propanol (isopropyl alcohol) Commercially available grades (industrial use) should be used. Demineralized or distilled water having a resistivity of not less than 500 m corresponding to a conductivity of 2 mS/m. * Temperature and time: 30 seconds under the temperature below 50 C or 3 minutes below 30 C. * Ultrasonic cleaning: Below 20 W.
Reflow Solder Profile
240 220 200
Temperature ( C )
10 s max. @ 230 C 2 C - 4 C/s
180 160 140 120 100 80 60 40 20 0 0 50 100 150 200 250 300 350 2 C - 4 C/s 120 s - 180 s 90 s max
16735
Time ( s )
Reflow Solder Profile
Assembly Instructions
Reflow Soldering * Reflow soldering must be done within 72 hours stored under max. 30 C, 60 % RH after opening envelop * Recommended soldering paste (composition: SN 63 %, Pb 37 %) Melting temperature 178 C to 192 C * Apply solder paste to the specified soldering pads, by using a dispenser or by screen printing. * Recommended thickness of metal mask is 0.2 mm for screen printing. * The recommended reflow furnace is a combinationtype with upper and lower heaters. * Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown below. Excercise extreme care to keep the maximum temperature below 230 C. The following temperature profile means the tempera ture at the device surface. Since temperature differ ence occurs between the work and the surface of the circuit board depending on the pes of circuit board or reflow furnace, the operating conditions should be verified prior to start of operation. * Handling after reflow should be done only after the work surface has been cooled off.
Document Number 82166 Rev. 5, 14-Aug-03
Temperature ( C )
240 220 200 180 160 140 120 100 80 60 40 20 0 0
10 s max. @ 230 C
2 C - 4 C/s
120 s - 180 s
90 s max
2 C - 4 C/s
50
100
150 200 250 Time ( s )
300
350
16944
www.vishay.com 13
TSOP5700
Vishay Semiconductors Taping Version TSOP..TT
VISHAY
www.vishay.com 14
Document Number 82166 Rev. 5, 14-Aug-03
VISHAY
Taping Version TSOP..TR
TSOP5700
Vishay Semiconductors
Document Number 82166 Rev. 5, 14-Aug-03
www.vishay.com 15
TSOP5700
Vishay Semiconductors Reel Dimensions
VISHAY
www.vishay.com 16
Document Number 82166 Rev. 5, 14-Aug-03
VISHAY
Leader and Trailer
TSOP5700
Vishay Semiconductors
Cover Tape Peel Strength
According to DIN EN 60286-3 0.1 to 1.3 N 300 10 mm/min 165 - 180 peel angle
Label
Standard bar code labels for finished goods The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data.
Dry Packing
The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage.
Final Packing
The sealed reel is packed into a cardboard box. A secondary cardboard box is used for shipping purposes.
Document Number 82166 Rev. 5, 14-Aug-03
www.vishay.com 17
TSOP5700
Vishay Semiconductors Recommended Method of Storage
Dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: * Storage temperature 10 C to 30 C * Storage humidity 60 % RH max. After more than 72 hours under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 hours at 40 C + 5 C/ -0 C and < 5 % RH (dry air/ nitrogen) or 96 hours at 60 C +5 C and < 5 % RH for all device containers or 24 hours at 125 C +5 C not suitable for reel or tubes. An EIA JEDEC Standard JESD22-A112 Level 4 label is included on all dry bags. Example of JESD22-A112 Level 4 label
VISHAY
ESD Precaution
Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the Antistatic Shielding Bag. Electro-Static Sensitive Devices warning labels are on the packaging.
Vishay Semiconductors Standard Bar-Code Labels
The Vishay Semiconductors standard bar-code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Telefunken specific data.
www.vishay.com 18
Document Number 82166 Rev. 5, 14-Aug-03
VISHAY
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements.
TSOP5700
Vishay Semiconductors
2. Regularly and continuously improve the performance of our products, processes, distribution and operatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
Document Number 82166 Rev. 5, 14-Aug-03
www.vishay.com 19

▲Up To Search▲

Price & Availability of TSOP5700

	To Download TSOP5700 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .